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Moncef Bey
JS-03 Grinding Tip For IPhone Android Huawei
JS-03 Layer Plate Tungsten Steel Main Board Welding Point Polishing Head for iPhone HUAWEI Android Motherboard Middle Layer
0.3mm suitable for iPhone
0.4mm for Android
0.5mm for HUAWEI and other mid level larger points
15.00 TND
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Description
JS-03 Layer Plate Tungsten Steel Main Board Welding Point Polishing Head for iPhone HUAWEI Android Motherboard Middle Layer
0.3mm suitable for iPhone
0.4mm for Android
0.5mm for HUAWEI and other mid level larger points
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