XZZ iSocket Logic Board Test Fixture for iPhone 13 / 14 / 15 / 16 Series
Professional logic board testing fixture (iSocket) by XZZ, available in dedicated versions covering the latest Apple devices (iPhone 13, 14, 15, and 16 series). The optimal engineering solution for temporarily connecting and fully testing the upper and lower logic board layers post-separation and prior to the final reballing and soldering process, saving critical repair time and preventing thermal damage from repeated heating.
480.00 TND – 550.00 TNDPrice range: 480.00 TND through 550.00 TND
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Delivery
Delivery to your specified address
7 TND
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Local pickup
To pick up from Nanotek
Free
Moncef Bey
Description
The XZZ iSocket is an indispensable mechanical fixture in micro-soldering workshops when repairing modern iPhone dual-layer logic boards (Sandwich Boards). This tool enables the technician to temporarily bridge the upper layer (Main Board) with the lower layer (RF/Baseband Board) using highly precise Pogo Pins without requiring actual soldering. This allows for fully powering on the device to extensively test boot sequences, network signals (Baseband), touch, and audio functionalities, accurately pinpointing faults and confirming repair success before permanently sealing the logic board.
Technical Specifications & Features:
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Precise Engineering Compatibility: Available as individual fixtures tailored to the exact internal layout of each specific series (13, 14, 15, and 16 Series across all Pro and Pro Max variants).
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Premium Pogo Pins: Constructed from gold-plated copper to ensure flawless transmission of signals and voltages with exceptionally high corrosion resistance.
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Perfect Mechanical Alignment: The CNC-machined mold strictly guarantees the perfect alignment of both layers to absolutely prevent any short circuits during power delivery.
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Advanced Repair Efficiency: Completely eliminates the need for repeated thermal cycles to separate and resolder the board after every single repair attempt, actively protecting the CPU and NAND from direct thermal degradation.
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