MiJing LWS-301 Laser Intelligent Soldering Station

Scope of application: Disassembly and assembly of glass chips, disassembly and assembly of small components, and removal of glue from pads
Features: Breaking the traditional air gun disassembly and assembly of chips, the power is adjustable, the heating area is adjustable, the chip is disassembled in seconds, and the board layer and surrounding components are not damaged.
Warm reminder: Please use special ceramic tweezers to remove chips and components