New Arrivals Equipments Tools Hand tools JS-03 Grinding Tip For IPhone Android Huawei

JS-03 Grinding Tip For IPhone Android Huawei

JS-03 Layer Plate Tungsten Steel Main Board Welding Point Polishing Head for iPhone HUAWEI Android Motherboard Middle Layer

0.3mm suitable for iPhone

0.4mm for Android

0.5mm for HUAWEI and other mid level larger points

15.00 TND

0.3mm
0.4mm
0.5mm
  • Delivery

Delivery to your specified address

7 TND

4 Dec - 5 Dec
  • Local pickup

To pick up from Nanotek

Free

Moncef Bey

SKU: 385 Category:

Description

JS-03 Layer Plate Tungsten Steel Main Board Welding Point Polishing Head for iPhone HUAWEI Android Motherboard Middle Layer

0.3mm suitable for iPhone

0.4mm for Android

0.5mm for HUAWEI and other mid level larger points

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