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Moncef Bey
BEST Solder Ball 0.2mm For BGA IC Reballing
This item is used for BGA IC reballing and specific tools like BGA reballing stencil are required in this process,
15.00 TND
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Description
BGA SOLDER BALL SIZE FOR MICRO WELDING MOBILE PHONE REPAIR TOOLS SOLDERING BALL DIAMETER 0.2MM
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