BEST Solder Ball 0.2mm For BGA IC Reballing
This item is used for BGA IC reballing and specific tools like BGA reballing stencil are required in this process,
15.00 TND
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Delivery
Delivery to your specified address
7 TND
- Local pickup
To pick up from Nanotek
Free
Moncef Bey
Description
BGA SOLDER BALL SIZE FOR MICRO WELDING MOBILE PHONE REPAIR TOOLS SOLDERING BALL DIAMETER 0.2MM
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SKU: 145
