YCS Tin Planting ARC Pad BGA IC Soldering Heat-Resistant Mat

Name: YCS Tin Planting ARC Pad BGA IC Soldering Heat-Resistant Mat
SKU: 972
Availability: InStock

YCS Universal Insulation Tin-Plating Curved Pad for Mobile Phone Motherboard CPU IC BGA Soldering Heat Dissipation Mat Cushion

YCSARC pad (0.3mm 0.45mm 0.77mm).

55.00 TND

In stock

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Delivery

Delivery to your specified address

7 TND

3 Jun - 4 Jun

Local pickup

To pick up from Nanotek

Free

Moncef Bey

SKU: 972 Category: Soldering and Hot Air

Description

. YCS ARC Pad planting tin silicone mat with 0.3mm 0.45mm 0.77mm slot for mobile phone motherboard CPU NAND Chip BGA reballing soldering repair.
. The strong magnetic adsorption steel mesh will not fall off even if it is thrown wildly. The strong magnetic design makes the steel mesh not easy to fall off and shift, and the tinning is more firm and stable.
. The heat dissipation holes on the back design prevent the steel mesh from bulging during tinning. The heat dissipation holes design prevents the steel mesh from bulging during tinning, and the strong magnetic adsorption steel mesh is also not easy to shift.