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Moncef Bey
YCS Tin Planting ARC Pad BGA IC Soldering Heat-Resistant Mat
YCS Universal Insulation Tin-Plating Curved Pad for Mobile Phone Motherboard CPU IC BGA Soldering Heat Dissipation Mat Cushion
YCSARC pad (0.3mm 0.45mm 0.77mm).
60.00 TND
Out of stock
Out of stock
Description
. YCS ARC Pad planting tin silicone mat with 0.3mm 0.45mm 0.77mm slot for mobile phone motherboard CPU NAND Chip BGA reballing soldering repair.
. The strong magnetic adsorption steel mesh will not fall off even if it is thrown wildly. The strong magnetic design makes the steel mesh not easy to fall off and shift, and the tinning is more firm and stable.
. The heat dissipation holes on the back design prevent the steel mesh from bulging during tinning. The heat dissipation holes design prevents the steel mesh from bulging during tinning, and the strong magnetic adsorption steel mesh is also not easy to shift.
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