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RELIFE TF2 Plus Motherboard Insulated tempered glass fixture
RELIFE TF2 Plus Heat-Insulating Glass PCB Board Repair Fixture Mobile Phone CPU IC Chip Glue Clean BGA Desoldering Holder Clamp
Original price was: 100.00 TND.80.00 TNDCurrent price is: 80.00 TND.
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Description
1.Commonly used in various mobile phone motherboards, small and portable, chip clamping.
2.Made of high-quality silicone, high strength, wear resistance, corrosion resistance, high temperature resistance and anti-scalding, protecting working hands.
3.Inward bevel design, precise and firm clamping, motherboard suspended in the air to effectively prevent heat loss caused by motherboard heat conduction, quick desoldering to protect motherboard.
4.High temperature resistant tempered glass panel，High temperature resistant 500℃+, long-term use without deformation, no fear of high temperature.
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