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RELIFE TF1 Mini Insulated Tempered Glass Fixture
The RELIFE TF1 Mini is a high-temperature tempered glass insulating pad specially designed for smartphone motherboard repairs. Compact, practical, and durable, it is an essential tool for technicians specializing in micro-soldering and integrated circuit repair.
80.00 TND
In stock
In stock
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Delivery
Delivery to your specified address
7 TND
12 May - 13 May
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Local pickup
To pick up from Nanotek
Free
Moncef Bey
Description
- Mini and Portable Size: Suitable for small mobile phone motherboards, ideal for chip removal and installation operations (CPU, memory, hard drive, etc.).
- Wide Compatibility: Suitable for a wide range of electronic components: ICs, chips, CPUs, hard drives, etc., for versatile and efficient repairs.
- Premium Material: Made of high-quality silicone, offering resistance to wear, high temperatures (up to 500°C), corrosion, and burns, while protecting hands during work.
- Internal Bevel Design: Ensures precise and stable component clamping, suspends the motherboard in the air to reduce heat dissipation by conduction, allowing for rapid desoldering without damaging the circuits.
- High-strength tempered glass panel: Will not warp under prolonged heat, even above 500°C, ensuring optimal durability under intensive use.
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