“Mijing K23 PCB Jig Fixture for Mobile Phone Motherboard Fixing Tool IC Chip BGA” has been added to your cart. View cart
RELIFE TF1 Mini Insulated Tempered Glass Fixture
The RELIFE TF1 Mini is a high-temperature tempered glass insulating pad specially designed for smartphone motherboard repairs. Compact, practical, and durable, it is an essential tool for technicians specializing in micro-soldering and integrated circuit repair.
80.00 TND Original price was: 80.00 TND.60.00 TNDCurrent price is: 60.00 TND.
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Delivery
Delivery to your specified address
7 TND
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Local pickup
To pick up from Nanotek
Free
Moncef Bey
Description
- Mini and Portable Size: Suitable for small mobile phone motherboards, ideal for chip removal and installation operations (CPU, memory, hard drive, etc.).
- Wide Compatibility: Suitable for a wide range of electronic components: ICs, chips, CPUs, hard drives, etc., for versatile and efficient repairs.
- Premium Material: Made of high-quality silicone, offering resistance to wear, high temperatures (up to 500°C), corrosion, and burns, while protecting hands during work.
- Internal Bevel Design: Ensures precise and stable component clamping, suspends the motherboard in the air to reduce heat dissipation by conduction, allowing for rapid desoldering without damaging the circuits.
- High-strength tempered glass panel: Will not warp under prolonged heat, even above 500°C, ensuring optimal durability under intensive use.
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90.00 TND


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