MaAnt SL-1 Constant Heating Platform For Glue Removal

Name: MaAnt SL-1 Constant Heating Platform For Glue Removal
SKU: 511
Availability: OutOfStock

Compatible with chips smaller than 20mm x 18.5mm, suitable for more than 99% of chips on the market.
One-button heating, rapid heating, adjustable temperature range of 160-250°C, suitable for the removal of glue and tin from multiple generations of iPhones and Huawei chips.

100.00 TND

Out of stock

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Delivery

Delivery to your specified address

7 TND

13 May - 14 May

Local pickup

To pick up from Nanotek

Free

Moncef Bey

SKU: 511 Category: Soldering & Hot Air

Description

No need for solder wick, residual solder can be easily cleaned using a cotton swab, without damaging the solder pads.
Heating without a hot air gun, the temperature is 100 degrees lower than that of a hot air gun, making glue or tin removal safer.
Heating without a soldering iron, no need for repeated scraping with a soldering iron, and no damage to the solder pads.
Low voltage heating plate, non-traditional high-voltage heating, no leakage of electric static.
Curved heating, no need to worry about thermal stress causing chip damage.
Full bonding design, no need to worry about chip deformation or damage due to the chip’s bottom lifting.