-20%
MaAnt SL-1 Constant Heating Platform For Glue Removal
Compatible with chips smaller than 20mm x 18.5mm, suitable for more than 99% of chips on the market.
One-button heating, rapid heating, adjustable temperature range of 160-250°C, suitable for the removal of glue and tin from multiple generations of iPhones and Huawei chips.
Original price was: 100.00 TND.80.00 TNDCurrent price is: 80.00 TND.
In stock
In stock
-
Delivery
Delivery to your specified address
7 TND
- Local pickup
To pick up from Nanotek
Free
Moncef Bey
Description
- No need for solder wick, residual solder can be easily cleaned using a cotton swab, without damaging the solder pads.
- Heating without a hot air gun, the temperature is 100 degrees lower than that of a hot air gun, making glue or tin removal safer.
- Heating without a soldering iron, no need for repeated scraping with a soldering iron, and no damage to the solder pads.
- Low voltage heating plate, non-traditional high-voltage heating, no leakage of electric static.
- Curved heating, no need to worry about thermal stress causing chip damage.
- Full bonding design, no need to worry about chip deformation or damage due to the chip’s bottom lifting.
Customer Reviews
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