LUOWEI LW-PT03 BGA CPU Reballing Tin Planting Platform
LUOWEI LW-PT03 LW-PT02 CPU Chip Tin Planting Platform with Heat-resistant Silicone Pad for Electronics/Mobile Phone BGA Chips Soldering Repair. Anti-slip, no bulging, high temperature resistant. Luowei multi-function BGA reballing magnetic platform has zero error positioning and expandable base, suitable for chips with thickness less than 0.9mm and double-layer components.
60.00 TND
Out of stock
Out of stock
This product is currently sold out.
No worries! Enter your email, and we'll let you know as soon as it's back in stock.
-
Delivery
Delivery to your specified address
7 TND
-
Local pickup
To pick up from Nanotek
Free
Moncef Bey
Description
Customer Reviews
Only logged in customers who have purchased this product may leave a review.
Related Products
-12%
AMAOE Stencil Qualcomm-QU7
SKU:
131
In stock
Original price was: 17.00 TND.15.00 TNDCurrent price is: 15.00 TND.
-12%
AMAOE Stencil Huawei-HW17
SKU:
126
In stock
Original price was: 17.00 TND.15.00 TNDCurrent price is: 15.00 TND.
BGA Stencil
Consumables
Hand tools
Pcb Fixture
Tool Organizer
Reviews
Clear filtersThere are no reviews yet.