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Moncef Bey
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LUOWEI LW-PT03 BGA CPU Reballing Tin Planting Platform
LUOWEI LW-PT03 LW-PT02 CPU Chip Tin Planting Platform with Heat-resistant Silicone Pad for Electronics/Mobile Phone BGA Chips Soldering Repair. Anti-slip, no bulging, high temperature resistant. Luowei multi-function BGA reballing magnetic platform has zero error positioning and expandable base, suitable for chips with thickness less than 0.9mm and double-layer components.
60.00 TND
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