BEST Solder Ball 0.2mm For BGA IC Reballing
This item is used for BGA IC reballing and specific tools like BGA reballing stencil are required in this process,
15.00 TND
Out of stock
Out of stock
-
Delivery
Delivery to your specified address
7 TND
3 Apr - 4 Apr
-
Local pickup
To pick up from Nanotek
Free
Moncef Bey
Description
BGA SOLDER BALL SIZE FOR MICRO WELDING MOBILE PHONE REPAIR TOOLS SOLDERING BALL DIAMETER 0.2MM
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