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Amaoe IP16 3-in-1 Motherboard Middle Layer BGA Reballing Stencil Platform Set for iPhone 16 Series - Image 1

Amaoe IP16 3-in-1 Motherboard Middle Layer BGA Reballing Stencil Platform Set for iPhone 16 Series - Image 2

Amaoe IP16 3-in-1 Motherboard Middle Layer BGA Reballing Stencil Platform Set for iPhone 16 Series

Name: Amaoe IP16 3-in-1 Motherboard Middle Layer BGA Reballing Stencil Platform Set for iPhone 16 Series
Brand: Amaoe
SKU: 1075
Availability: OutOfStock

AMAOE 3-in-1 0.12mm iPhone 16 Series motherboard middle layer positioning mold with 0.12mm tin planting mesh net.

75.00 TND

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7 TND

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Moncef Bey

SKU: 1075 Category: BGA Stencil Brand: Amaoe

Description

1. For iPhone 16/16 Plus/16 Pro/16 Pro Max motherboard middle layer tin planting. Precise positioning, fast tin planting.
2. Built-in high-temperature magnet, strong magnetic adsorption, precise positioning, no deviation, high-temperature magnetism unchanged.
3. Strong magnetic adsorption, precision hole pitch design.
4. Round and square precise holes, make the tin balls more rounded and prevent the mesh from getting stuck in the tin balls.