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Moncef Bey
Amaoe IP16 3-in-1 Motherboard Middle Layer BGA Reballing Stencil Platform Set for iPhone 16 Series
AMAOE 3-in-1 0.12mm iPhone 16 Series motherboard middle layer positioning mold with 0.12mm tin planting mesh net.
75.00 TND
In stock
In stock
Description
1. For iPhone 16/16 Plus/16 Pro/16 Pro Max motherboard middle layer tin planting. Precise positioning, fast tin planting.
2. Built-in high-temperature magnet, strong magnetic adsorption, precise positioning, no deviation, high-temperature magnetism unchanged.
3. Strong magnetic adsorption, precision hole pitch design.
4. Round and square precise holes, make the tin balls more rounded and prevent the mesh from getting stuck in the tin balls.
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