Amaoe Android Cpu Stencil MQ:3
Amaoe MQ3 BGA Reballing Stencil for SM8250 MT6885Z SM6125 SM7150 SM7250 SDM865 Qualcomm MTK CPU RAM IC Chip Tin Plant Steel Mesh
15.00 TND
In stock
In stock
-
Delivery
Delivery to your specified address
7 TND
-
Local pickup
To pick up from Nanotek
Free
Moncef Bey
SKU: 193 Category: BGA Stencil Tags: Amaoe, bga, mediatek, Reballing, Stencil, Stencil Qualcomm, ستنسل, شبلنة
Description
Amaoe MQ3 BGA Reballing Stencil for SM8250 MT6885Z SM6125 SM7150 SM7250 SDM865 Qualcomm MTK CPU RAM IC Chip Tin Plant Steel Mesh
Customer Reviews
Related Products
Amaoe Android Cpu Stencil HU 1-3
Rated 0 out of 5
In stock
15.00 TND
Select options This product has multiple variants. The options may be chosen on the product page
SKU: 038