New Arrivals Equipments Tools BGA Stencil GSM-SOURCES Swap Board MP-01 Platform Set for Iphone series
GSM-SOURCES Swap Board MP-01 Platform Set for Iphone series
GSM-SOURCES Swap Board MP-01 Absorption Positioning Tin Planting Platform Set for Iphone series
Absorption Positioning Tin Planting Platform Set for Iphone
HIGH TEMPERATURE RESISTANT ULTRA-THIN POSITONING PLATE
STRONGER ADSORPTION TIN PLATING NET
170.00 TND
In stock
In stock
- Delivery
Delivery to your specified address
7 TND
14 Oct - 15 Oct
- Local pickup
To pick up from Nanotek
Free
Moncef Bey
SKU:
766
Category: BGA Stencil
Description
Automatic precise positioning
The new magnetic dynamic original positioning
Strong magnetic force automatic clamping
Installation Method:
Prepare the tin planting platform and close the chip with a small triangle,
fixed on the clamping position (It shall be consistent with the direction of the steel mesh)
Place the steel mesh directly on the slot of the magnetic suction base to complete the installation
(Check whether the mesh is aligned with the bottom chip)
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